Product Description
-The 7 inch touch screen panel for navigation USES industrial grade chip CYPRESS IC, which has strong anti-interference performance and can be used in a variety of complex application environments. Such as work well with 3-10mm thickness tempered glass, water, gloves, seawater, 5% saline and PC onside.
-The 7 inch touch screen panel for navigation interface is I2C interface, but we can convert I2C interface into USB interface through USB converter.
-The 7 inch touch screen panel for navigation support customization of structure and surface treatment, Anti-Glare, Anti-Reflection, Anti-Fingerprint treatment. Our 7 inch touch screen panel for navigation may be produced in a selected shape, color, size of cover glass, thickness, corner with logo and other additional elements as per specification provided by the client.
Model Number | HX0701601 |
Brand | Grahowlet |
Size | 7 inch |
Interface Type | I2C/USB |
Structure | G+G |
Controller IC | CYTMA568 |
Touch Points | 10 points |
Transparency | ≥85% |
Surface Hardness | ≥6H |
Operating Environment | -20℃ ~ 70℃,≤85% RH |
Storage Environment | -30℃ ~ 80℃,≤85% RH |
Power Supply Voltage | 2.8V~3.3V |
Outline Dimension | 165.00(W)*100.00(H)*1.45(D) mm |
Viewing Area | 154.88(W)*86.72(H) mm |
Support Systems | Windows/Android/Linux etc. |
Warranty | 1 year |
Application
Custom Service
FAQ
Q: What is the reason for the capacitive screen module turn white screen when it fall to the ground after being assembled into a finished product?
A: The reasons are probably: IC cracking, poor FPC binding, structural interference LCD cracking, etc.; IC is broken when falling, FPC bonding not good, structural interference, LCD broken…
IC broken is because it is impacted by external force, for example, first, there is something on the casing or there is something inside the LCM that hit the IC here; second is that the edge that the IC sits on is deformed for some reason, causing the IC height to exceed the backlight surface and then break when falling;
the countermeasure is to check the components near the IC that may impact it, to leave it as far as possible from the IC or add some protection for IC.
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