Full lamination, also known as non-air-gap technology, allows for a clear view of image differences from a full-surface fit image reflected from the screen. This is the mainstream development trend of high-end SMT chip processing smart phone and tablet panel. The process and components of the touch panel seem to be simple, but in fact the touch panel process is very varied. In terms of technology, the front-end process and the back-end process are highly variable and growing.
The all-round bonding technology is to glue the panel directly to the outer glass (or touch panel) with glue. Since the middle is in a vacuum state, the light refraction problem can be avoided, but if the traditional lip glue is attached, it is very It is easy to see the phenomenon of overlapping like two pieces of glass. In addition, the full-surface fit makes the screen more high-brightness and high-fidelity realism, even under the outdoor glare, you can still clearly see the screen display content of SMT processing mobile phones or tablets.
Full-surface fit will be an unsuitable trend, but the current challenge is that the fit is much more difficult than the touch panel glass capacitor fit, and the larger the size, the harder it is to fit. The price of both the LCD panel and the touch panel is not low. In the event of damage during the bonding process, the loss will be very large.
