Product Description
The projected capacitive 13.3 touch screen with cypress touch controller ic can support operation with gloves, water , and working well with 10mm thick tempered glass or thick PC on top of the cover glass, , mainly used in medical products, advertising equipment, portable mobile terminals, security and other fields, support depth customization, including structural parts and Special surface treatment --AG AR AF, irregular structure etc.
The projected capacitive 13.3 touch screen is exported directly from USB interface, 1920*1080 resolution display screen and EDP interface, which can be compatible with various common Operation systems, it can be equipped with drive board and cable, which is more suitable for flat assemble module structure installation products. The silk screen printing around is black, the display polarizer is relatively black, so the Black effect of the air bonding is better;
| Model Number | HX1331806 |
| Brand | Grahowlet |
| Size | 13.3 inch |
| Operating Temperature | -20℃ ～ 70℃ |
| Storage Temperature | -30℃ ～ 80℃ |
| Outline Dimension | 333.76(W)x210.24(H)x4.65(D) mm |
| Viewing Area | 294.76(W)x166.24(H) mm |
| Active Area | 293.76(W)x165.24(H) mm |
| Support Systems | Windows/Android/Linux etc. |
| Warranty | 1 year |
| Interface Type | IIC/USB |
| Structure | G+G |
| Controller IC | Cypress |
| Touch Points | 10 points |
| Transparency | ≥85% |
| Surface Hardness | ≥6H |
| Power Supply Voltage | 2.8V ～ 3.3V |
| Resolution | 1920*1080 |
| Interface Type | EDP/HDMI/VGA |
| Luminance | 300 cd/m² |
| Viewing Angle | ALL |
Technical Q&A
Q: Under what circumstances will the optical bonding touch screen module solution be considered?
A: 1. If the customer has higher requirements for the overall beauty of the product, they can consider the optical bonding because the whole black effect of the whole module is very good after the optical bonding; 2. If the customer's product itself has high requirements such as anti-shock effect and impact resistance in its working environment, the optical bonding solution can be considered; 3. If the customer's product is used outdoors and have certain requirements on the visual effect of the Sun and the stability of the hot & cold shocks and the overall structure, the optical bonding plan needs to be considered;
Q: What are the strategies for ESD in EMC testing of complete end products?
A: the overall solution is to flow static electricity to the ground. There are roughly the following suggestions:
1), power supply plus TVs Tube: for ESD protection of power supply VCC, TVs tube can be connected and solved. The TVs tube is very similar to the voltage regulator diode. It has a rated voltage. The difference is that its response speed is particularly fast and it has a good discharge effect on static electricity.
2) ESD protection of the external interface signal line: you can consider and connect the reverse diode to guide the current to the power supply or ground;
3), LC filtering is added to the power supply of sensitive devices: Some IC is particularly susceptible to static electricity. When ESD tests are carried out, reset or death always occurs. The reason is that the power supply pin is usually disturbed. For this, LC filtering can be added to its power supply.
4) PCB paving requirements: PCB should be paved as much as possible. If it is a double panel, both sides should be paved with copper in a large area, and there should be enough ground holes. If it is a four-layer board or above, the adjacent plane layer of the main component layer should be set to a formation.
5) grounding requirements: to effectively release static electricity, a good grounding must be guaranteed. For example, medical electronics, general medical electronic products such as monitors, there will be an equal potential grounding end behind the fuselage. When doing ESD tests, this grounding end is also connected to the Earth, so there is a way to quickly discharge static electricity. 6) PCB layout wiring: If the decoupling capacitor of the chip is far away from the pin of the chip, the decoupling effect will be lost. If the line of sensitive signals is too long, unexpected electromagnetic interference will be introduced. In terms of anti-ESD, sensitive devices or signal lines (such as reset) should be kept away from the edge of the PCB to prevent air discharge from interfering directly with the devices and signal lines. The PCB edge should have a certain width of the gap or copper.
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